86-755-33930808
Number |
Items |
Technical Data |
|
1 |
Max Layer Count |
40 |
|
2 |
Max Board Size |
620mm*1200mm |
|
3 | Board Thickness |
2 Layer |
0.2mm-6.0mm |
4 Layer |
0.4mm-6.0mm |
||
6 Layer |
0.8mm-6.0mm |
||
8 Layer |
1.0mm-6.0mm |
||
10 Layer |
1.2mm-6.0mm |
||
12 Layer |
1.4mm-6.0mm |
||
14 Layer |
1.5mm-6.0mm |
||
16 Layer |
1.6mm-6.0mm |
||
18 Layer |
2.2mm-6.0mm |
||
20 Layer |
2.4mm-6.0mm |
||
4 |
Min Trace Width |
2.5mil |
|
5 |
Min Trace Space |
2.5mil |
|
6 | Min Hole Size |
Through Hole |
0.15mm |
Laser Via Hole |
0.075mm |
||
7 |
PTH Tolerance |
+/-0.075mm |
|
8 |
NPTH Tolerance |
+/-0.05mm |
|
9 |
Outline Tolerance |
+/-0.1mm |
|
10 |
Hole Position Tolerance |
+/-0.05mm |
|
11 |
Min Soldermask Bridge |
0.075mm |
|
12 |
Hole Wall Copper Thickness |
10um-50um |
|
13 | Copper Thickness |
Inner Layer |
0.5oz-5oz |
Outer Layer |
0.5oz-13oz |
||
14 |
Surface Finish |
HASL, OSP, Immersion Gold/Silver/Tin, Flash Gold, Golden Finger, Immersion Gold + OSP |
|
15 |
Insulation Resistance |
1*1012Ω |
|
16 |
Aspect Ratio |
Through Hole:13:1 |
|
17 |
Warp And Twist |
≤0.7% |
|
18 |
Impedance Control |
+/-10% |
|
19 |
Flame Retardance |
94V-0 |
|
20 |
Material |
FR4, CEM3 High TG FR4, Rogers,Teflon,PTFE,Arlon,Taconic, Metal Clad |
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