JETFGO

Shenzhen JETFGO Circuits Co.,LtdProfessional PCB manufacturer

Hotline86-755-33930808

Process Capability
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Number

Items

Technical Data

1

Max Layer Count

40

2

Max Board Size

620mm*1200mm

3 Board Thickness

2 Layer

0.2mm-6.0mm

4 Layer

0.4mm-6.0mm

6 Layer

0.8mm-6.0mm

8 Layer

1.0mm-6.0mm

10 Layer

1.2mm-6.0mm

12 Layer

1.4mm-6.0mm

14 Layer

1.5mm-6.0mm

16 Layer

1.6mm-6.0mm

18 Layer

2.2mm-6.0mm

20 Layer

2.4mm-6.0mm

4

Min Trace Width

2.5mil

5

Min Trace Space

2.5mil

6 Min Hole Size

Through Hole

0.15mm

Laser Via Hole

0.075mm

7

PTH Tolerance

+/-0.075mm

8

NPTH Tolerance

+/-0.05mm

9

Outline Tolerance

+/-0.1mm

10

Hole Position Tolerance

+/-0.05mm

11

Min Soldermask Bridge

0.075mm

12

Hole Wall Copper Thickness

10um-50um

13 Copper Thickness

Inner Layer

0.5oz-5oz

Outer Layer

0.5oz-13oz

14

Surface Finish

HASL, OSP, Immersion Gold/Silver/Tin, Flash Gold, Golden Finger, Immersion Gold + OSP

15

Insulation Resistance

1*1012Ω

16

Aspect Ratio

Through Hole:13:1
     Blind Hole:2:1

17

Warp And Twist

≤0.7%

18

Impedance Control

+/-10%

19

Flame Retardance

94V-0

20

Material

FR4, CEM3 High TG FR4, Rogers,Teflon,PTFE,Arlon,Taconic, Metal Clad

    Shenzhen Address:  Building 18,First Zone, Xinxing Industrial Park, Fuhai Street Office, Bao’an District, Shenzhen

    Tel:  0755-33930808  Fax:  0755-33930800

    E-MAIL: sal@jetfgo.com

    HK Address:Room 02,21/F, Hip Kwan Commercial Building, 38 Pitt Street, Yau Ma Tei, Kowloon, Hong Kong.

    Phone: 13682557588 Fax:    00852-31040202

    E-MAIL: 13825298356@qq.com

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